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57.Sihn S., Ganguli S., Roy A., Qu L.T., Dai L.M., “Enhancement of through-thickness thermal conductivity in adhesively bonded joints using aligned carbon nanotubes”, Composites Science and Technology, 2008, 68(3–4), 658–665. |
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- 上一页:56.Bergeson J.D., Etzkorn S.J., Murphey M.B., Qu L.T., Yang J.B., Dai L.M., Epstein A.J. “Iron nanoparticle driven spin-valve behavior in aligned carbon nanotube arrays”, Appl. Phys. Lett., 2008, 93(17), 172505 (1–3).
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